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　　对于用人单位来说，简历是第一关，面试才是第二关。在简历中，人事经理往往会侧重于观察简历是否已经达到了招聘条件，如果达到了则会考虑通知当事人来面试。所以，在写简历时一定要关注对方的招聘条件，并在自己所写的简历中努力达到对方所要求的水平。这样他们就会通知你去面试了。毕业生个人简历制作时一定要尽情地表现你自己，而不是别人。在你的个人简历中展现你的技能，并用你自己取得的成果证明它们。

　　如果你写作表达能力差，最好请写作能力比较强的人帮忙，你可以通过自己口述的方式让别人边听边写，用合适的词来描述你自己。另外写简历不必拘泥于格式：简历是你自己的简历，所以不管你写什么，只要看着合情合理就行。简历最好就是实话实说的表现自己，过高的虚夸或者是过于谦虚都不好。在个人简历中，你千万不要简单地列举你所干过的职务，强调你都干了些什么。一定要重点强调你能干某项工作的特别技能以及你所取得的成就和证书，就是一份简单的简历也应这样写。别过分谦卑：像面试一样，你的简历不能太谦卑。

Name:fwdq Sex： Date of Birth：  Hukou： Residency： Work Experience： Current Salary： Tel： E-mail：www.fwdq.com Career Objective Desired Industry： Electronics/Semiconductor/IC ,Science/Research ,Government ,Others ,Testing, Certification Desired Position： Senior Hardware Engineer ,Semiconductor Technology, Branch Office Manager ,Chief Representative ,Research Specialist Staff Desired address： Shanghai ,Hongkong ,Beijing ,Taiwan ,Macao Desired Salary： Negotiable Work Experience 2006/06—Present ***Company   Industry: Electronics/Semiconductor/IC
Intel Flash Engineering Department Individual Contributor
Responsibilities：
I have been working in Intel Flash Assembly & Test Engineering
Department as an Individual Contributor since June of 2006.
Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. Our efforts are paid off:
1. The yield of year 2006 has been dramatically increased than that of year 2005.
2. The yield of all products, consecutively meets the goal.
3. The total amount of cost saving due to yield improvement is more than $1 million compared with year 2005. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2007.
Report Directly to: Department ManagerNumber of Subordinate: 14
Reference: Bao Powel
Achievements: Being Leader of ATE Yield team, I have been working with the team members to improve the products yield.
Our efforts are paid off:
1. The yield of year 2006 has been dramatically increased than that of year 2005.
2. The yield of all products, consecutively meets the goal.
3. The total amount of cost saving due to yield improvement is more than $1 million compared with year 2005. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2007. 2006/01—2006/05 Intel(Shanghai) Technology Development Ltd. Company   Industry: Electronics/Semiconductor/IC
Intel STTD-China Department Electronics Development Engineer
Responsibilities：
1. I had been working in STTD-China since Jan 2006 to May 2006 as a senior module engineer.
2. At that time, as a main contributor of this project, we succeeded in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one time.
Report Directly to: Hopman Mark   Number of Subordinate: 14
Reference: Bao Powel
Reason for Leaving: I was transferred to Intel（Shanghai）Products Ltd. Company due to the internal re-organization in June of 2006.
Achievements: As a main contributor of STTD-China department, I co-work with my colleagues to succeed in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one cycle. 2005/05—2006/01 Nanyang University of Science & Technology   Industry: Electronics/Semiconductor/IC
Electronics & Electrical Engineering Department Research Fellow
Responsibilities：
1. I work in Electronics & Electrical Engineering Department of Nanyang University of Science & Technology as a Research Fellow.
2. I majored at Gate Oxide Reliability Research in the duration.
Report Directly to: Professor Pey Kin Leoh 
Subordinate: 3
Reference: Patrick Low
Reason for Leaving: I completed the project which I undertook by myself, and want to do more challenging job.
Achievements: In less than one year, I made a lot of experiments and acquired the wonderful data for the project by myself.  Project Experience 2008/01—Present Assembly NPI (New Product Introduction)   Project Description: To introduce more products into Intel Flash Assembly factory, I join Assembly NPI team and work as the team leader. I coordinate with IE, Planner, Marketing guy and Engineer to select new product items, do demo in factory, and then qualify it.
Responsibility: I am working as NPI Team leader and coordinate all team members, define the NPI candidate, make Assembly build plan, follow up the progress. 2007/01—2007/12 Marginal Electrical Boards Rescue   Project Description: To rescue some electrical boards of testing equipment, a Task Force team was built up and led by me. We categorized each kind of board, made historical failure analysis on each kind of board and around &2.5 million dollars was saved finally.
Responsibility: Being the team leader, I took the job of data analysis, define each member's role, make program plan, coordinate each team member and follow up the progress. 2006/10—2007/05 Optimization the current Test Process Order for Flash Memory   Project Description: To simplify the current Test procedure and enhance the working efficiency, a Task Force team has been called and started by me.
Responsibility: Being the Project leader, I take the main responsibility, such as, design, plan, organize and implement. 2006/05—2006/12 Test Yield of Flash memory Improvement   Project Description: To improve the test yield of different products, a Task Force team was built up and led by me. Being the team leader, I worked with all team members to dig out the failure root cause for each product, defined action taken plan for each emergency case, coordinated each team member and make pro-active plan to avoided unexpected things happen.
Responsibility: Being the team leader of Improving Test Yield, coordinate each team member, make program plan and follow up.  Education and Training 2005/05—2006/01 Nanyang University of Science & Technology Microelectronics Doctorate   I worked in Nan yang University of Science & Technology as a Research Fellow. I major at Gate oxide Reliability research in the duration. 2004/03—2005/03 Seoul National University of Korea Microelectronics Others   I had been working in National Physical Lab of Seoul National University in Korea since March of 2004 to March of 2005 as a Post-doctor. Where I unhook the project of research & development of Carbon-Nan tube Biosensor. And only after one year, an EIS sensor based on CMOS technology has been successfully produced. And one SCI paper about it has been published in Semiconductor Science and Technology. 2001/03—2004/03 Shanghai Institute of Microsystems and Information Technology，Chinese Academy of Sciences Information Technology Doctorate 1998/09—2001/03 Nanjing University of Science & Technology Material Science and Engineering Master   Being a master student of this period, I have published one EI paper about Super-fine metal power's electrical characteristics. 1993/09—1997/07 Nanjing University of Science & Technology Material Science and Engineering Bachelor 1997/07—1998/07 Assistant Engineer in Quality Verification Department, Boiler Factory in Zhengzhou city of Henan resistant Engineer in Quality Verification Department  Professional Skills Language Skills： English: EXCELLENT
Korean: AVERAGE Computer Skills： Technology   skilled 96Month
SAP   understanding 8Month Certificate： 2000/11  MCSE
1999/06  CET6  Self-appraisal 7 years working experience of Semiconductor Industry and where 2 years overseas working/study experience. Smart working, innovation thinking and very talented creative working model.

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